Apple has taken a major step in its long-term strategy of vertical integration with the introduction of two new custom wireless chips in the iPhone Air. The C1X and N1 chips represent a significant leap in performance and power efficiency, crucial for the device’s breakthrough thin design, and signal a future where Apple controls all key silicon in its products.
The C1X modem handles cellular connectivity, supporting sub-6GHz 5G and 4G LTE. According to Apple, the new chip is up to two times faster than its predecessor, the C1 modem found in the iPhone 16e. More notably, Apple claims the C1X outperforms the Qualcomm-designed modem used in the current iPhone 16 Pro models when using the same cellular technologies. Perhaps most critical for the slim iPhone Air is the chip’s power efficiency. Apple states the C1X achieves these performance gains while using thirty percent less energy overall, a vital feature for a device with a smaller-than-average battery.
For the first time, Apple has offloaded Wi-Fi and Bluetooth duties to a dedicated, custom-designed chip. The new N1 chip manages a suite of wireless protocols, including Wi-Fi 7, Bluetooth 6 for accessory connectivity, and Thread for smart home device control. This separation of cellular and other wireless functions onto specialized silicon allows for optimized performance and power management.
Together, the C1X and N1 chips work alongside the new A19 Pro processor, which features a 6-core CPU, a 5-core GPU, and a 16-core Neural Engine. This combination delivers pro-level computing power within an exceptionally thin form factor, a feat made possible by the extreme efficiency of these new custom components.
This move is a clear indication of Apple’s overarching hardware ambition to eliminate its reliance on external silicon partners. The primary motivations for this shift are twofold. First, it allows Apple to avoid paying licensing fees to companies like Qualcomm, potentially improving its margins. Second, and more importantly, it grants Apple complete control over the design, feature set, and power management of its components. This deep level of hardware and software integration is a cornerstone of the Apple ecosystem, enabling the company to create unique features and efficiencies that are difficult for competitors to replicate.
Looking ahead, Apple’s ultimate goal is believed to be the integration of the modem directly into its main application processor, creating a single, unified system-on-a-chip. While this final step is reportedly still several years away, the successful deployment of the C1X and N1 chips marks a pivotal moment. It demonstrates that Apple can not only design but also successfully implement its own critical wireless components, paving the way for a fully custom silicon future across its entire product line.
