Technology

Open-design bento infographic for POSTECH 4x HBM density: 4.2x density gain, 10+ layer count, market map, bottleneck stats, timeline to production

Korea’s POSTECH Demonstrates 4× Denser HBM Stacking, Cracking the AI Memory Bottleneck

Researchers at South Korea’s Pohang University of Science and Technology have demonstrated a new chip-stacking technique that produces memory densities four times higher than the 12-high HBM stacks currently in volume production at Samsung Electronics and SK Hynix. The breakthrough, published in the journal Nature Electronics on July 9 and developed in partnership with the

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Open-design infographic briefing on SK Hynix's $26.5 billion Nasdaq debut, the largest share sale by a foreign company on a U.S. exchange, with full deal details and timeline.

SK Hynix’s $26.5 Billion Nasdaq Debut Marks Largest Foreign Listing in US History

SK Hynix closed its first day of trading on the Nasdaq with a roughly 13 percent gain, capping the largest share sale ever conducted by a foreign company on a U.S. exchange and cementing the South Korean chipmaker’s position at the centre of the global artificial intelligence hardware supply chain. The Korean memory giant raised

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SK Hynix $26.5B Nasdaq ADR listing infographic

SK Hynix Prices $26.5B Nasdaq Listing at a Rare Premium to Korea

South Korean memory chipmaker SK Hynix has priced its blockbuster Nasdaq American Depositary Receipt offering at $149 per share, raising approximately $26.5 billion in what is now the largest first-time U.S. stock sale by a foreign company and the third-largest listing in global market history. The pricing, completed on Friday in Seoul, was set at

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