TSMC is sitting on roughly $1 billion worth of Apple A20 Pro processors that cannot be shipped because there is not enough DRAM to complete the packaging process. The bottleneck, first reported by independent semiconductor analyst Tim Culpan on his Culpium newsletter on August 6 and corroborated by 9to5Mac and other outlets, is the most
Tesla and SpaceX announced a $16.8 billion initial investment in Terafab, a Texas facility for advanced logic and memory chips, packaging and testing.
Sandisk and SK hynix released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project, with Google and Tenstorrent as consortium members.
Anthropic confirmed it is assembling an in-house silicon team to co-design a Claude inference chip, with possible Samsung partnership for zHBM packaging and a t
Anthropic Is Building Its Own Chip to Run Claude. The Reason Isn’t Speed. It’s Cost. Read More »
Galaxy Z Fold 8 pre-orders hit 3x Fold 7 levels. Base Fold 8 shipping slips into October; T-Mobile Cream variant in shortest supply; Ultra delayed weeks.
FMS: The Future of Memory and Storage 2026 opens Tuesday at the Santa Clara Convention Center and runs through August 6, with a debate running through all three days that will shape how AI inference infrastructure gets built for the next decade. The question is which technology fills the gap between the GPU’s small, expensive
FMS 2026 Opens With a Quiet Fight Over the Memory Hierarchy That Powers AI Inference Read More »
Apple’s September event on Sept 8-9 will reveal iPhone 18 Pro, Pro Max, and the first book-style foldable. Standard iPhone 18 delayed to spring 2027 launch.
Apple September Event Will Skip the Standard iPhone 18 and Put the Foldable Center Stage Read More »
Apple is expected to launch five products in September as reports point to MacBook Air delivery delays linked to a broader memory supply squeeze.
Qualcomm will raise Snapdragon chip prices by double digits on products shipped after September 1, 2026. Mobile memory ASPs already up 70-83 percent in Q2 per T
Samsung’s $200 Billion Broadcom Deal Tests Whether Vertical Integration Can Break TSMC’s Foundry Lock Samsung Electronics has signed a memorandum of understanding with Broadcom at the AI Summit in San Francisco on July 25, 2026, that the two companies expect to be worth more than $200 billion across memory and foundry services through 2030. The
