Grok 4.6 ties GPT-5.6 Sol on the Artificial Analysis Intelligence Index, signaling tighter competition among frontier AI foundation models for enterprise use.
Grok 4.6 Matches GPT-5.6 Sol on Independent AI Benchmarks Read More »
TSMC raises planned US investment to $265 billion citing robust AI chip demand. The chipmaker accelerates Arizona expansion amid stronger-than-expected quarterly results.
TSMC Boosts US Investment to $265B as AI Chip Demand Stays Strong Read More »
TSMC unveils its A13 process node and commits to an Arizona advanced packaging facility by 2029, while sidelining high-NA EUV through 2029.
TSMC Unveils A13 Node, Locks In Arizona Packaging Site for 2029 Read More »
TSMC July 2026 revenue jumped 44.7% YoY, lifting full-year guidance above 40% as AI demand and a $60B-$64B capex plan keep the cycle rolling.
TSMC July 2026 revenue jumps 44.7% as AI demand lifts full-year outlook Read More »
Intel priced an upsized $20B stock offering at $95 per share after institutional orders hit $100B, oversubscribing the deal 5x despite retail dilution fears.
Intel Prices $20B Stock Offering at $95 as Wall Street Floods Deal With $100B in Orders Read More »
Sony and TSMC are in talks for a ¥1 trillion ($6.4B) image sensor joint venture in Kumamoto, Japan, targeting 2029 production for AI and automotive demand.
Sony and TSMC Near ¥1 Trillion Image Sensor Joint Venture in Japan Read More »
Hisense has firmed up the launch details for what is shaping up as one of the more unusual smartphones of the year. According to Notebookcheck, the Hisense A10, an e-ink handset with a magnetic detachable color display, will go on sale in China on August 28, 2026. The date closes a months-long tease that began
Hisense Built an E-Ink Phone With a Detachable Color Screen. It Launches August 28. Read More »
TSMC is sitting on roughly $1 billion worth of Apple A20 Pro processors that cannot be shipped because there is not enough DRAM to complete the packaging process. The bottleneck, first reported by independent semiconductor analyst Tim Culpan on his Culpium newsletter on August 6 and corroborated by 9to5Mac and other outlets, is the most
Tesla and SpaceX announced a $16.8 billion initial investment in Terafab, a Texas facility for advanced logic and memory chips, packaging and testing.
Sandisk and SK hynix released the first High Bandwidth Flash (HBF) technical specification through the Open Compute Project, with Google and Tenstorrent as consortium members.
